Micro Low Power Laser Materials Processing

Micro and Low Power Laser Materials Processing

The Optech Consulting market report MICRO AND LOW POWER LASER MATERIALS PROCESSING covers laser applications with an average power of less than 1 kW:

  • Markets for lasers (laser sources) <1 kW
  • Markets for laser systems (processing equipment) with lasers < 1kW

Application areas:

  • Microelectronics processing: semiconductors, flat panel displays, printed circuit boards, electrical vehicle batteries, solar cells, fiber optic devices, etc.
  • Precision welding, cutting, and drilling
  • Laser additive manufacturing
  • Marking
  • Other low power laser materials processing: non-metal cutting, plastics welding, cleaning, soldering, etc.

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Optech Consulting market report MICRO AND LOW POWER LASER MATERIALS PROCESSING

  • Report published: 3 January 2023
  • Number of pages: 223
  • Market data for 2022 (base year)
  • Market forecast to 2030
  • Historic data provided for reference
  • Highly detailed market share data for lasers and laser systems for 2022
  • Global market and geographic markets

OPTECH CONSULTING Report on Micro Low Power Laser Materials Processing
Table of Contents

  1. Executive Summary
  2. Market Overview Laser Systems
    1.1. Present Market
    1.2. Market Trend and Forecast
  3. Market Overview Laser Sources
    2.1. Present Market
    2.2. Market Forecast
  4. Micro Electronics Materials Processing – Applications and System Markets
    3.1. Overview
    3.2. Semiconductor Manufacturing
    3.2.1. Market Overview
    3.2.2. IC performance: Lithography and Semiconductor Packaging
    3.2.3. DUV and EUV
    3.2.4. DUV Lithography
    3.2.5. EUV Lithography
    3.2.6. Dicing of Semiconductors and Related Applications
    3.2.6.1. Overview
    3.2.6.2. Si Dicing and Grooving
    3.2.6.3. DAF (Die Attach Film) Cutting
    3.2.6.4. Dicing of Other Semiconductors
    3.2.6.5. LED Dicing
    3.2.6.6. Dicing of Non-Semiconductors and Microelectronic Components
    3.2.6.7. Package Singulation and Leadframe Cutting
    3.2.6.8. Ablative Dicing and Laser Types
    3.2.6.9. Non-Ablative Dicing and Laser Types
    3.2.6.10. Laser Dicing System Market
    3.2.7. Memory Repair and Wafer Level Trimming
    3.2.8. Silicon Drilling
    3.2.9. Semiconductor and LED lift-off
    3.2.10. Other Semiconductor Processing Applications
    3.3. Printed Circuit Board Manufacturing and IC Packaging
    3.3.1. Overview
    3.3.2. Laser Via Drilling
    3.3.3. Overview
    3.3.4. CO2 Laser Via Drilling
    3.3.5. Via Drilling With UV and Ultrafast Lasers
    3.3.6. Laser Direct Imaging
    3.3.7. LDS – Laser Direct Structuring
    3.3.8. Hybrid Circuit and Resistor Trimming
    3.3.9. Solder Mask Cutting
    3.3.10. PCB and Flex Board Cutting, Routing, Skiving
    3.3.11. Ceramic Substrate Processing
    3.3.12. Other Applications in Laser PCB Processing
    3.4. Flat Panel Display Manufacturing
    3.4.1. Overview
    3.4.2. Annealing
    3.4.3. FPD Cutting – Overview
    3.4.4. FPD Glass Cutting Technologies – Background
    3.4.5. FPD – Cutting of Display Glass for LCDs, Rigid OLEDs
    3.4.6. FPD – Cutting of Touchpanel and Lens Cover Glass
    3.4.7. Cutting of Flexible OLEDs
    3.4.8. FPD Repair
    3.4.9. Laser Lift-Off Flexible Displays
    3.4.10. Laser Lift-Off (LLO) and Laser Induced Forward Transfer (LIFT) for Micro LEDs
    3.4.11. ITO Structuring / Etching
    3.4.12. Lithography Mask Writing
    3.4.13. Other Applications
    3.5. Solar Cell Manufacturing
    3.5.1. Overview
    3.5.2. Solar Cell Market – Status and Forecast – Demand for Laser Equipment
    3.5.3. Thin Film Solar Cell Structuring
    3.5.4. Thin Film Solar Cell Edge Deletion
    3.5.5. Crystalline Solar Cell Structuring, Drilling, Selective Doping
    3.5.6. Crystalline Solar Cell Stringer Soldering
    3.5.7. Crystalline Solar Cell Cutting
    3.5.8. Crystalline Solar Cell – Other Applications
    3.6. Electrical Vehicle Battery Manufacturing
    3.6.1. Overview
    3.6.2. Electrode and separator foil cutting
    3.6.3. Electrode foil structuring
    3.6.4. Cleaning
    3.6.5. Tab to terminal welding with nanosecond pulsed FL
    3.6.6. Electrode foil welding
    3.7. Other Microprocessing
    3.7.1. Market and Market Forecast
    3.7.2. Microfluidics
    3.7.3. Fiber-Optic Components
    3.7.4. HDD Drive Applications
    3.7.5. Surface Structuring Applications
  5. Markets for Steered-Beam Laser Marking Systems
    4.1. Overview – Market and Market Forecast
    4.2. Technology Background – Types of laser Marking, Lasers Used
    4.3. Steered Beam Marking Using Bulk SSL and FL
    4.4. Laser Coding
    4.5. CO2 Laser Marking
  6. Markets for Precision Processing, Additive Manufacturing and Other Low Power Laser Materials Processing Systems
    5.1. Overview
    5.2. Low and Medium Power CO2 Laser Cutting Systems
    5.3. Medium Power Laser Cutting Systems with Fiber Lasers and Nd:YAG Lasers
    5.4. Fine and Precision Welding
    5.5. Fine Cutting
    5.6. Drilling
    5.7. Plastics Welding
    5.8. Soldering
    5.9. Additive Laser Processes
    5.10. Textile Design and Aging
    5.11. Converting and Packaging Applications
    5.12. Printing Industry Applications, Pad Printing Plates
    5.13. Cleaning, de-coating
    5.14. Laser Shaping
    5.15. Laser Texturing
  7. Markets for Low Power Laser Sources – Overview
    6.1. Markets for Laser Sources by Application Sector
    6.2. Markets for Laser Sources by Laser Type
  8. Markets for Low Power Laser Sources – Market Details by Laser Type and Application
    7.1. Overview
    7.2. Microprocessing
    7.2.1. Overview
    7.2.2. SSL in Microprocessing, Overview
    7.2.2.1. SSL for Semiconductor Processing
    7.2.2.2. SSL for PCB and Hybrid Circuit Processing
    7.2.2.3. SSL for Solar Cell Processing
    7.2.2.4. SSL for FPD Processing
    7.2.2.5. SSL for EV Battery Manufacturing
    7.2.2.6. SSL for Other Microprocessing Applications
    7.2.3. Ultrafast Lasers in Microprocessing
    7.2.4. Excimer Lasers in Microprocessing
    7.2.5. CO2 Lasers in Microprocessing
    7.2.6. Diode Lasers in Microprocessing
    7.3. Marking and Coding
    7.3.1. Lasers in Steered Beam Marking and Coding – Market Overview
    7.3.2. Nanosecond Pulsed Lasers in Steered Beam Marking: FL and Bulk SSL
    7.3.3. Ultrafast Lasers in Steered Beam Marking and Coding
    7.3.4. CO2 Lasers in Steered Beam Marking and Coding
    7.4. Fine Cutting, Drilling, Welding and Other Low Power Materials Processing
    7.4.1. Overview
    7.4.2. Bulk SSL and FL in Fine Cutting, Drilling, Welding, and Other Low Power Materials Processing
    7.4.2.1. SSL for Cutting, Drilling, and Ablative Processes
    7.4.2.2. SSL for Precision Welding and Additive Applications
    7.4.3. Ultrafast Lasers in Fine and Precision Processing
    7.4.3.1. Overview
    7.4.3.2. Major Applications of Ultrafast Lasers in Fine and Precision Processing
    7.4.3.3. Femto vs Picosecond Lasers
    7.4.3.4. Ultrafast Fiber Lasers vs Ultrafast Bulk Lasers
    7.4.4. CO2 Lasers in Fine Cutting, Drilling, Welding, and Other Low Power Materials Processing
    7.4.5. Diode Lasers in Fine Processing and Other Low Power Materials Processing
  9. Summary on Markets for Ultrafast Lasers
    8.1. Technology
    8.2. Market
  10. Market Shares for Laser Systems for Micro and Low Power Materials Processing
    9.1. Market Shares for Laser Microprocessing Systems
    9.2. Market Shares for Steered Beam Laser Marking Systems
    9.3. Market Shares for Laser Systems for Low and Medium Power Cutting, Precision Processing, Additive Manufacturing, and Other Low Power Materials Processing
  11. Market Shares for Low Power Lasers
    10.1. Market Shares for Lasers in Microprocessing
    10.2. Market Shares for Lasers for Marking
    10.3 Market Shares for Lasers for Low and Medium Power Cutting, Precision Processing, Additive Manufacturing, and Other Low Power Applications
    10.3. Market Shares for Ultrafast Lasers for Materials Processing
  12. Geography of End Markets for Laser Systems
    11.1. Market for Laser Micro Materials Processing Systems, by Geography
    11.2. Market for Laser Marking Systems, by Geography
    11.3. Market for Precision and Other Low Power Processing Systems, by Geography

Please see also Laser Materials Processing – Market Data.